Leadless plastic chip carrier with standoff contacts and die...

Details Leadless plastic chip carrier with standoff contacts and die... Leadless plastic chip carrier with standoff contacts and die...

2006-05-23

2006-05-23

Nelms, David (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257S676000

Reexamination Certificate

active

07049177

ABSTRACT:
A process for fabricating a leadless plastic chip carrier includes selectively etching at least a first surface of a leadframe strip to partially define at least a plurality of contact pads and a die attach pad; selectively plating at least one layer of metal on a second surface of the leadframe strip, on an undersurface of at least the plurality of contact pads and the die attach pad; mounting a semiconductor die on the first surface, on the partially defined die attach pad; wire bonding the semiconductor die to ones of the contact pads; encapsulating the wire bonds and the semiconductor die in a molding material such that the molding material covers a first portion of the die attach pad and first portions of the contact pads; selectively etching a second surface of the leadframe strip to define a second portion of the contact pads and a second portion of the die attach pad by etching the second surface with the at least one layer of metal resisting etching; and singulating the leadless plastic chip carrier from the leadframe strip.

REFERENCES:
patent: 4530152 (1985-07-01), Roche et al.
patent: 5457340 (1995-10-01), Templeton, Jr. et al.
patent: 5710695 (1998-01-01), Manteghi
patent: 5910644 (1999-06-01), Goodman et al.
patent: 5976912 (1999-11-01), Fukutomi et al.
patent: 6001671 (1999-12-01), Fjelstad
patent: 6229200 (2001-05-01), Mclellan et al.
patent: 6400004 (2002-06-01), Fan et al.
patent: 6545347 (2003-04-01), McClellan
patent: 6812552 (2004-11-01), Islam et al.
patent: 2002/0197826 (2002-12-01), Kim et al.
patent: 59-208756 (1984-11-01), None

Affiliated with

Also associated with

Rating

Leadless plastic chip carrier with standoff contacts and die... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Leadless plastic chip carrier with standoff contacts and die..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Leadless plastic chip carrier with standoff contacts and die... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3597459