Leadless plastic chip carrier with etch back pad singulation

Details Leadless plastic chip carrier with etch back pad singulation Leadless plastic chip carrier with etch back pad singulation

2006-01-24

2006-01-24

Tran, Minh-Loan (Department: 2826)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S112000, C438S123000

Reexamination Certificate

active

06989294

ABSTRACT:
A leadless plastic chip carrier is constructed by half etching one or both sides of the package design onto a leadframe strip so as to create unique design features such as power and/or ground ring surrounding the die attach pad, interlocking rivet head construction for the contact pads, and an interlocking pattern for the die attach pad. After wire bonding and molding, a further etching is performed to isolate and expose contact pads. Singulation of individual chip packages from the leadframe strip is then performed by saw singulation or die punching.

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