Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Having light transmissive window
Reexamination Certificate
2006-09-26
2006-09-26
Pham, Hoai (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Having light transmissive window
C438S064000
Reexamination Certificate
active
07112471
ABSTRACT:
A leadless image sensor package and methods for its assembly. In a first embodiment, an image sensor chip is mounted within a bottom-side cavity of a package shell in a flip-chip manner such that sensing circuitry on the image sensor chip is exposed through an aperture in the top side of the package shell. A transparent encapsulant material is deposited within the aperture to encase interconnect bonds between the package shell and the image sensor chip. A transparent lid is held in place over the aperture by the encapsulant material. The back surface of the image sensor chip is left exposed. In a second embodiment particularly suitable for high-end image sensors, an encapsulant material is not required. Instead, a backing cap is hermetically sealed to a ledge surface in the package shell to cover the bottom-side cavity. A compression member formed on the backing cap contacts the image sensor chip and maintains interconnect bond integrity.
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Boon Suan Jeung
Chia Yong Poo
Chua Swee Kwang
Low Siu Waf
Neo Yong Loo
Hafiz Mursalin B.
Micro)n Technology, Inc.
Pham Hoai
TraskBritt
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