Leadframe tip arrangement designing method

Details Leadframe tip arrangement designing method Leadframe tip arrangement designing method

1997-06-30

1999-05-11

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438123, H01L21/44

Patent

active

059021195

ABSTRACT:
A designing method calculates leadframe tip arrangement. The method comprises the steps of setting a leadframe tip arrangement region opposed to a die pad sideline of a leadframe, setting a leadframe tip arrangement line in the leadframe arrangement region, and arranging a predetermined number of leadframe tips on the leadframe tip arrangement line at proper intervals. The method allows for the independent calculation of various parameters.

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patent: 5438021 (1995-08-01), Tagawa et al.
patent: 5451812 (1995-09-01), Gomi
patent: 5635424 (1997-06-01), Rostoker

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