4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Assembly of plural semiconductive substrates each possessing...

Satoshi Ookyuu

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Circuit wiring system circuit wiring method semi-conductor...

Semiconductor device manufacturing: process – Making device array and selectively interconnecting – With electrical circuit layout
Reexamination Certificate

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Designing method of leadframe tip arrangement

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent

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Leadframe tip arrangement designing method

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Patent

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Leadframe tip arrangement designing method

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Patent

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Profile ID: LFUS-PAI-P-391479

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