Leadframe design for QFN package with top terminal leads

Details Leadframe design for QFN package with top terminal leads Leadframe design for QFN package with top terminal leads

2011-06-14

2011-06-14

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S784000, C257SE23047

Reexamination Certificate

active

07960815

ABSTRACT:
A semiconductor package includes a leadframe. A first lead finger has a lower portion, a connecting portion extending vertically upward from the lower portion, and a substantially flat, top portion. The top portion forms a top terminal lead structure. A second lead finger is electrically connected to the first lead finger. A portion of the second lead finger forms a bottom terminal lead structure. A portion of the second lead finger corresponds to a bottom surface of the semiconductor package. A surface of the substantially flat, top portion corresponds to a top surface of the semiconductor package.

REFERENCES:
patent: 5428248 (1995-06-01), Cha
patent: 5436492 (1995-07-01), Yamanaka
patent: 5583371 (1996-12-01), Hori
patent: 6329705 (2001-12-01), Ahmad
patent: 6427976 (2002-08-01), Huang et al.
patent: 6821817 (2004-11-01), Thamby et al.
patent: 2008/0036051 (2008-02-01), Espiritu et al.

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