Lead-free, tin-based multi-component solder alloys

Details Lead-free, tin-based multi-component solder alloys Lead-free, tin-based multi-component solder alloys

1996-03-06

1998-03-24

Ip, Sikyin

Alloys or metallic compositions

Tin base

Antimony, or bismuth containing

2281801, 22818021, 437211, C22C 504

Patent

active

057309329

ABSTRACT:
The present invention provides a solder alloy having from about 80-81% tin, from about 2-4% silver, from about 5-6% indium, and from about 10-12% bismuth by weight, and microelectric circuits soldered by this alloy.

REFERENCES:
patent: 4170472 (1979-10-01), Olsen et al.
patent: 4806309 (1989-02-01), Tulman
patent: 5229070 (1993-07-01), Melton et al.
patent: 5256370 (1993-10-01), Slattery et al.
patent: 5328660 (1994-07-01), Gonya et al.
patent: 5344607 (1994-09-01), Gonya et al.
patent: 5538686 (1996-07-01), Chen et al.

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