4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Bump leads

Amit K. Sarkhel

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Electronic package interconnect structure comprising...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Electronic package interconnect structure comprising...

Metal fusion bonding – Process – Plural joints
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High density column grid array connections and method thereof

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
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Integrated semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
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Lead-free solder structure and method for high fatigue life

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Profile ID: LFUS-PAI-P-1058292

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