Lead-free, tin, antimony, bismtuh, copper solder alloy

Details Lead-free, tin, antimony, bismtuh, copper solder alloy Lead-free, tin, antimony, bismtuh, copper solder alloy

1993-06-16

1995-05-02

Kastler, Scott

Alloys or metallic compositions

Tin base

Copper containing

148400, 148405, C22C 1302

Patent

active

054117038

ABSTRACT:
A high solidus temperature, high service temperature, high strength multi-component solder alloy having a major portion of Sn and effective amounts of Sb, Bi and Cu.

REFERENCES:
patent: 3607253 (1971-09-01), Cain
patent: 4643875 (1987-02-01), Mizuhara
patent: 4667871 (1987-05-01), Mizuhara
patent: 4778733 (1988-10-01), Lubrano et al.
patent: 4797328 (1989-01-01), Boehm et al.
patent: 4806309 (1989-02-01), Tulman
patent: 4929423 (1990-05-01), Tucker et al.
patent: 5314758 (1994-05-01), Carey, II et al.
McCormack et al., "Progress in the Development of New Lead-Free Solder Alloys," JOM Jul. 1993, vol. 45, No. 7 pp. 36-40.
Journal Environmental Science, A26(6), 911-929 (1991) (no month available) K. S. Subramanian et al "Leaching Of Antimony, Cadmium, Copper Lead, Silver, Tin and Zinc From Copper Piping With Non-Lead-Based Soldered Joints".

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