Lead frame surface finish enhancement

Details Lead frame surface finish enhancement Lead frame surface finish enhancement

1994-09-01

1997-04-01

Meier, Stephen

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257696, 257750, 257762, 257766, H01L 2348, H01L 2940

Patent

active

056169531

ABSTRACT:
An multiple lead semiconductor integrated circuit package incorporating a silicon die wire bonded to a lead frame plated by high purity copper. The die and the lead frame are encapsulated in an epoxy compound with lead fingers from the lead frame extending outside of the encapsulated compound. The high copper plating on the lead frame, which lead frame is not composed of high purity copper, increases the conductivity thereof so as to improve the signal speed for the lead frame. A thinner copper plating on the lead frame can be used without a decrease in signal speed as frequency of the signal is increased.

REFERENCES:
patent: 4707724 (1987-11-01), Suzuki et al.
patent: 5331235 (1994-07-01), Chun

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