4. Inductor devices
  5. With supporting and/or spacing means between coil and core
  6. Preformed insulation between coil and core

I-Chi Cheng

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active

Lead frame structure and applications thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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Transformers and winding units thereof

Inductor devices – With supporting and/or spacing means between coil and core – Preformed insulation between coil and core
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3160526

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