Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Patent
1993-01-25
1994-08-09
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With separate tie bar element or plural tie bars
257666, 257671, H01L 2348, H01L 2944, H01L 2952, H01L 2960
Patent
active
053369270
ABSTRACT:
A semiconductor device includes an element mounting portion, suspending leads, a large number of inner leads, a semiconductor element, and insulating tapes. The element mounting portion is arranged at a central portion of a lead frame. The suspending leads support four corners of the element mounding portion from a peripheral portion of the lead frame. The large number of inner leads are formed toward the element mounting portion. The semiconductor element is mounted on the element mounting portion and has electrode portions connected to distal ends of the inner leads. Each of the insulating tapes has cut portions obtained by partially cutting two corners of both ends of a rectangle of each of the tapes near the element mounting portion and projection portions projected from two corners of the rectangle far from the element mounting portion and each having the same shape of each of the cut portions. The insulating tapes are adhered to the inner leads parallelly to four sides of the semiconductor element. Each insulating tape has the both ends extending on the suspending leads to fix the inner leads.
REFERENCES:
patent: 4597816 (1986-07-01), Barnhart
patent: 4794446 (1988-12-01), Hamano
patent: 5051813 (1991-09-01), Schneider et al.
patent: 5176366 (1993-01-01), Masumoto et al.
Crane Sara W.
Jr. Carl Whitehead
NEC Corporation
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