Lead frame for semiconductor devices

Details Lead frame for semiconductor devices Lead frame for semiconductor devices

1995-01-12

1998-12-01

Wallace, Valencia Martin

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257666, 257677, 257741, 257784, 257796, H01L 23495, H01L 2348, H01L 2328

Patent

active

058443053

ABSTRACT:
A lead frame for a semiconductor device, comprising; a die pad having a major surface upon which a semiconductor die is placed, the major surface being clad with a metal layer, an inner lead portion electrically connected to the semiconductor die, wherein the die pad and the inner lead portion are embedded within a molding resin, and an outer lead portion exposed outside the molding resin, electrically connected to the inner lead portion, and adapted for connection to a printed circuit board land, wherein the die pad, inner lead portion, and outer lead portion are formed from a metal having a thermal expansion coefficient equal to that of the printed wiring board land.

REFERENCES:
patent: 4673967 (1987-06-01), Hingorany
patent: 5134459 (1992-07-01), Maeda et al.
patent: 5276351 (1994-01-01), Yamazaki et al.
patent: 5329158 (1994-07-01), Lin
patent: 5360991 (1994-11-01), Abys et al.
patent: 5455446 (1995-10-01), Suppelsa et al.

Affiliated with

Also associated with

Rating

Lead frame for semiconductor devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lead frame for semiconductor devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead frame for semiconductor devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2397850