Lead frame for integrated circuits

Details Lead frame for integrated circuits Lead frame for integrated circuits

1994-05-25

1997-03-11

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With separate tie bar element or plural tie bars

257666, 257676, H01L 23495

Patent

active

056104375

ABSTRACT:
This invention relates to lead frames upon which chips are mounted prior to encapsulation. A lead frame structure (6) for manufacturing an IC device comprises a lead frame base (1) including a plurality of leads (10) and four first tie bar portions (16) extending toward a die pad aperture (17). A die pad (2) forms a mounting surface (20) for receiving a chip (30) and includes four second tie bar portions (21) extending from the mounting surface (20) and corresponding to the four first tie bar portions (16). The die pad (2) is affixed to the lead frame base (1) and positioned in the aperture (17) by affixing each of the second tie bar portions (21) to a corresponding one of the first tie bar portions (16).

REFERENCES:
patent: 4868635 (1989-09-01), Frechette et al.
patent: 5196268 (1993-03-01), Fritz
patent: 5204287 (1993-04-01), McLellan et al.
patent: 5424576 (1995-06-01), Djennas et al.

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