Raymond A. Frechette

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Beryllium copper plating process

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Patent

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Ceramic coated plastic package

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Patent

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Dambarless leadframe for molded component encapsulation

Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article
Patent

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Dambarless leadframe for molded component encapsulation

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Flex circuit substrate for an integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Profile ID: LFUS-PAI-P-593533

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