Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate
2000-12-04
2002-05-21
Clark, Sheila V. (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With separate tie bar element or plural tie bars
C257S666000, C257S676000
Reexamination Certificate
active
06392288
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to semiconductor packaging in general and, more particularly, to a lead frame assembly for increasing metallic lead count in a thin small outline semiconductor package such as TSOP, MSOP, and other micro-series packages.
BACKGROUND OF THE INVENTION
Small outline packaging is well known in the art of micro series packages. Typical of the art are the TSOP 5 and TSOP 8 packages. The TSOP 5 package has a greater die-mounting pad than the TSOP 8 package but is only available with five external conductive leads. This limits the complexity and functionality of the semiconductor device that can be encapsulated within the package.
The TSOP 8 package can have eight isolated conductive leads for an 8 pin I/O count but has a restrictive die-mounting portion. This smaller die-mounting portion is typically too small to accommodate an eight pin semiconductor device. This packaging may result in higher/bigger packaging and required packaging space.
Accordingly, a need exists for a small outline package, which maintains the larger die-mounting area such as the TSOP 5 micro-series package while having superior lead count as available in the small outline micro-series package. In addition, the additional lead count should not cause an increase in the minimal packaging outline.
REFERENCES:
patent: 6118173 (2000-09-01), Emoto
patent: 6175150 (2001-01-01), Ichikawa et al.
patent: 6208023 (2001-03-01), Nakayama et al.
patent: 6242797 (2001-06-01), Ichikawa et al.
patent: 6288441 (2001-09-01), Corsis
Chew Chee Hiong
Tan Aik Chong
Tan Shan Chong
Clark Sheila V.
Semiconductor Components Industries LLC
LandOfFree
Lead frame for assembly for thin small outline plastic... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Lead frame for assembly for thin small outline plastic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead frame for assembly for thin small outline plastic... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2835914