4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With structure for mounting semiconductor chip to lead frame

Chee Hiong Chew

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active

Circuit component and method of manufacture

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Lead frame for assembly for thin small outline plastic...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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Leadframe structure having moveable sub-frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Leadframe, method of manufacturing a leadframe, and method of pa

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Method of manufacturing a semiconductor component and...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Profile ID: LFUS-PAI-P-978420

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