Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate
2007-03-13
2007-03-13
Baumeister, B. William (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With stress relief
C257SE23037, C257S676000
Reexamination Certificate
active
11396608
ABSTRACT:
A lead frame is provided. Although there is a die pad (2) located to deviate from a main plane center line of a resin molding area (10), a die pad connecting portion (6) is located to deviate from the main plane center line of the resin molding area in a direction opposite to the deviation direction of the deviated die pad (2), so that it is possible to reduce a Z-directional vertical variation of the die pad in processes. Accordingly, it is possible to prevent resin molding defects such as package bending, voids, failure of resin filling, wire disconnection, exposure of semiconductor chips, and exposure of die pads.
REFERENCES:
patent: 6528868 (2003-03-01), Weiblen et al.
patent: 7071523 (2006-07-01), Yano et al.
patent: 3-256353 (1991-11-01), None
Fukuda Toshiyuki
Inui Tadahisa
Satou Motoaki
Baumeister B. William
Farahani Dana
Matsushita Electric - Industrial Co., Ltd.
Steptoe & Johnson LLP
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