Lead frame and production process thereof and production...

Details Lead frame and production process thereof and production... Lead frame and production process thereof and production...

2005-03-22

2005-03-22

Zarneke, David A. (Department: 2827)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

Reexamination Certificate

active

06870244

ABSTRACT:
A thermally conductive substrate includes a thermally conductive resin sheet member attached to a lead frame. The lead frame comprises a thermally conductive resin sheet member and it is integrated with the thermally conductive resin sheet member on the lead frame. The thermally conductive resin sheet member is formed from a thermosetting resin mixture comprises 70 to 90 parts by weight of an inorganic filler and 5 to 30 parts by weight of a thermosetting resin composition including a thermosetting resin, and the thermosetting resin is in a semi-cured state.

REFERENCES:
patent: 6060150 (2000-05-01), Nakatani et al.
patent: 6329045 (2001-12-01), Hirano et al.
patent: 6522555 (2003-02-01), Hirano et al.
patent: 6548152 (2003-04-01), Nakatani et al.
patent: 6570099 (2003-05-01), Hirano et al.
patent: 9-298344 (1997-11-01), None
patent: 9-321395 (1997-12-01), None
patent: 10-173097 (1998-06-01), None
US application Ser. No. 10/313,534, Nakatani et al.*
US application Ser. No. 09/956,208, Hirano et al.

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