Method producing a contact connection between a...

Details Method producing a contact connection between a... Method producing a contact connection between a...

2005-03-01

2005-03-01

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S107000, C438S458000

Reexamination Certificate

active

06861291

ABSTRACT:
A contact connection between a semiconductor chip and a substrate has a conductive adhesive extending between each contact of the chip and the substrate. The conductive adhesive includes a matrix component, a filler component, a hardener component and at least one decomposable component so that after curing at a curing temperature T1, the adhesive can be decomposed either by applying thermal energy at a temperature T2>T1or by radiation so that the two contact surfaces can be separated smoothly. After separation the purposes of replacing a defective semiconductor chip, a second chip can be mechanically connected by applying the adhesive and curing it.

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Abstract of Japanese Published Application 11054547 of Feb. 26, 1999,Patent Abstracts of Japan.
Abstract of Japanese Published Application 2000332058 of Nov. 30, 2000,Patent Abstracts of Japan.

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