Lead frame and method for manufacturing semiconductor...

Details Lead frame and method for manufacturing semiconductor... Lead frame and method for manufacturing semiconductor...

2007-07-31

2007-07-31

Coleman, William David (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With stress relief

C438S123000

Reexamination Certificate

active

11063353

ABSTRACT:
Provided is a method for manufacturing a lead frame and a semiconductor package having a semiconductor chip for connecting to an outer board and having a base metal layer formed of iron and nickel as main elements. The method includes preparing the base metal layer of a lead frame, forming one or more plating layers on the base metal layer, mounting the semiconductor chip on the lead frame, molding the semiconductor chip and at least a portion of the lead frame, bending the lead frame to form the lead frame in a predetermined shape, and heat-treating the lead frame for forming a diffusion layer in order to protect the lead frame from corrosion.

REFERENCES:
patent: 5994767 (1999-11-01), Huang et al.
patent: 6469386 (2002-10-01), Lee et al.
patent: 6518508 (2003-02-01), Park et al.
patent: 2002/0104682 (2002-08-01), Park et al.

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