Layer patterning using double exposure processes in a single...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Forming nonplanar surface

Reexamination Certificate

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C430S394000, C430S330000

Reexamination Certificate

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07923202

ABSTRACT:
A structure and a method for forming the same. The method includes providing a structure which includes (a) a to-be-patterned layer, (b) a photoresist layer on top of the to-be-patterned layer wherein the photoresist layer includes a first opening, and (c) a cap region on side walls of the first opening. A first top surface of the to-be-patterned layer is exposed to a surrounding ambient through the first opening. The method further includes performing a first lithography process resulting in a second opening in the photoresist layer. The second opening is different from the first opening. A second top surface of the to-be-patterned layer is exposed to a surrounding ambient through the second opening.

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patent: 6171761 (2001-01-01), Minamide et al.
patent: 6218089 (2001-04-01), Pierrat
patent: 6632590 (2003-10-01), Tzu et al.
patent: 2007/0212654 (2007-09-01), Larson et al.

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