Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Patent
1998-12-03
2000-10-03
Bowers, Charles
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
438305, H01L 21336
Patent
active
061272337
ABSTRACT:
A lateral MOSFET (100) and a method for making the same. A two layer raised source/drain region (106) is located adjacent a gate structure (112). The first layer (106a) of the raised source drain is initially doped p-type and the second layer (106b) of the raised source/drain region is doped n-type. P-type dopants from first layer (106a) are diffused into the substrate to form a pocket barrier region (105). N-type dopants from second layer (106b) diffuse into first layer (106a) so that it becomes n-type and into the substrate to form source/drain junction regions (104). P-type pocket barrier region (105) thus provides a barrier between the source/drain junction regions (104) and the channel region (108).
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1990 IEEE, Symposium on VLSI Technology, "A New Structural Approach for Reducing Hot Carrier Generation in Deep Submicron MOSFESTs," pp. 43-44 (Al F. Tasch, Hyungsoon Shin and Christine M. Maziar).
IEEE Electron Device Letters, vol. 12, Mar. 1991, "Raised Source/Drain MOSFET With Dual Sidewall Spacers," pp. 89-91 (Mark Rodder, Member IEEE, and D. Yeakley).
Bowers Charles
Brady III W. James
Garner Jacqueline J.
Hawranek Scott J.
Telecky Jr. Frederick J.
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