Lateral DMOS structure with lateral extension structure for...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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Details

C257SE21427, C257SE29012, C257S335000

Reexamination Certificate

active

07655515

ABSTRACT:
A high voltage lateral semiconductor device for integrated circuits with improved breakdown voltage. The semiconductor device comprising a semiconductor body, an extended drain region formed in the semiconductor body, source and drain pockets, a top gate forming a pn junction with the extended drain region, an insulating layer on a surface of the semiconductor body and a gate formed on the insulating layer. In addition, a higher-doped pocket of semiconductor material is formed within the top gate region that has a higher integrated doping than the rest of the top gate region. This higher-doped pocket of semiconductor material does not totally deplete during device operation. Moreover, the gate controls, by field-effect, a flow of current through a channel formed laterally between the source pocket and a nearest point of the extended drain region.

REFERENCES:
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patent: 0 115 098 (1984-08-01), None
patent: 401238062 (1989-09-01), None
patent: 404107870 (1992-04-01), None
Nezer et al., Optimization of the Breakdown Voltage in LDMOS Transistors Using Internal Field Rings, 1991, IEEE, CH2987, pp. 149-153.

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