Laser-induced structuring of substrate surfaces

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C257SE21347, C257SE21475, C438S378000, C438S795000

Reexamination Certificate

active

07816220

ABSTRACT:
In one aspect, the present invention provides a method of processing a substrate, e.g., a semiconductor substrate, by irradiating a surface of the substrate (or at least a portion of the surface) with a first set of polarized short laser pulses while exposing the surface to a fluid to generate a plurality of structures on the surface, e.g., within a top layer of the surface. Subsequently, the structured surface can be irradiated with another set of polarized short laser pulses having a different polarization than that of the initial set while exposing the structured surface to a fluid, e.g., the same fluid initially utilized to form the structured surface or a different fluid. In many embodiments, the second set of polarized laser pulses cause the surface structures formed by the first set to break up into smaller-sized structures, e.g., nano-sized features such as nano-sized rods.

REFERENCES:
patent: 6048588 (2000-04-01), Engelsberg
patent: 7057256 (2006-06-01), Carey et al.
patent: 2005/0226287 (2005-10-01), Shah et al.
patent: 2006/0079062 (2006-04-01), Mazur et al.
Zhu et al., “Effect of Polarization on Femtosecond Laser Pulses Structuring Silicon Surface”, Applied Surface Science, vol. 252 (2006), p. 2752-2756.
Huang et al., “A uniform 290 nm periodic Square Structure on ZnO Fabricated by Two—Beam Femtosecond Laser Ablation,” Nanotechnology, (2007), 18 (50), 505301/1-505301/6.
International Search Report and Written Opinion for PCT/US09/35239 dated May 8, 2009 (11 pages).

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