Laser exposure of photosensitive polyimide for pattern formation

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Forming nonplanar surface

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

430270, 430945, 522

Patent

active

053709748

ABSTRACT:
A method of patterning a preimidized benzophenone photoactive polymer used as a photoresist with a laser light source improves its crosslinking efficiency and reduces swelling, thereby enabling the formation of lines on the order of microns.

REFERENCES:
patent: 4812880 (1989-03-01), Ogawa et al.
patent: 4826756 (1989-05-01), Orvek
patent: 4883744 (1989-11-01), Feilchenfeld et al.
patent: 4902378 (1990-02-01), Ouderkirk
patent: 4968581 (1990-11-01), Wu et al.
patent: 4980268 (1990-12-01), Bartmann et al.
patent: 5001039 (1991-03-01), Ogoh
patent: 5122440 (1992-06-01), Chien

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Laser exposure of photosensitive polyimide for pattern formation does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Laser exposure of photosensitive polyimide for pattern formation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laser exposure of photosensitive polyimide for pattern formation will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-213545

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.