Laminated wafer sensor system for UV dose measurement

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure

Reexamination Certificate

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Details

C257SE33001, C355S072000, C355S053000, C250S252100

Reexamination Certificate

active

07638798

ABSTRACT:
A laminated wafer sensor structure includes a housing layer having pocket openings formed therein, a circuit layer having a sensor element and electronic components mounted for registration with the pocket openings in the housing layer, and a rigid back layer. The laminated structure is suitable for handling by conventional robotic wafer handling systems. The wafer sensor structure is adapted for electrical connection to a base station that is also adapted for connection to a host computer system to facilitate communication among the sensor structure, the base station and the host computer.

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