Method of making a compliant integrated circuit package

Details Method of making a compliant integrated circuit package Method of making a compliant integrated circuit package

2005-05-24

2005-05-24

Blum, David S. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S111000, C438S123000

Reexamination Certificate

active

06897090

ABSTRACT:
A component incorporating a dielectric element such as a polymeric film with leads and terminals thereon is assembled with a semiconductor chip and bond regions of the leads are connected to contacts of the chip. At least one lead incorporates a plural set of connecting regions connecting the bond region of that lead to a plurality of terminals. One or more of the connecting regions in each such plural set are severed so as to leave less than all of the terminals associated with each such plural set connected to the contacts of the chip.

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