Joining member for Z-interconnect in electronic devices...

Details Joining member for Z-interconnect in electronic devices... Joining member for Z-interconnect in electronic devices...

2006-08-01

2006-08-01

Chea, Thorl (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making named article

C430S311000, C430S317000, C430S324000, C029S830000, C029S846000, C029S852000, C029S860000

Reexamination Certificate

active

07083901

ABSTRACT:
A layer for use in a modular assemblage for supporting ICES is formed with metal contacts for assembly by making a sandwich of metal interconnect members between two layers of dielectric; drilling holes through the dielectric, stopping on a metal layer bonded to the bottom surface of the module; forming blind holes stopping on the interconnect members; and plating metal through the volume of the via, both full and blind holes, thereby forming vertical and horizontal connections in a layer that be stacked to form complex interconnect assemblies.

REFERENCES:
patent: 4889962 (1989-12-01), Hagner
patent: 4980034 (1990-12-01), Volfson et al.
patent: 5744758 (1998-04-01), Takenouchi et al.
patent: 6662443 (2003-12-01), Chou et al.

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