Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate
2007-12-25
2007-12-25
Lam, Cathy F. (Department: 1775)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
C526S262000, C428S625000, C428S626000, C528S322000, C528S423000
Reexamination Certificate
active
10502976
ABSTRACT:
The present invention relates to interlayer dielectric materials and pre-applied die attach adhesives, more specifically pre-applied die attach adhesives (such as wafer and other substrate-applied die attach adhesives), methods of applying the interlayer dielectric materials onto substrates to prepare low K dielectric semiconductor chips, methods of applying the pre-applied die attach adhesives onto wafer and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.
REFERENCES:
patent: 2928446 (1960-03-01), James et al.
patent: 4325985 (1982-04-01), Wallace
patent: 4632944 (1986-12-01), Thompson
patent: 5015695 (1991-05-01), Wong
patent: 5140404 (1992-08-01), Fogal et al.
patent: 5177032 (1993-01-01), Fogal et al.
patent: 5300608 (1994-04-01), Chu et al.
patent: 5323060 (1994-06-01), Fogal et al.
patent: 5585671 (1996-12-01), Nagesh et al.
patent: 5717034 (1998-02-01), Dershem et al.
patent: 5744513 (1998-04-01), White et al.
patent: 5789757 (1998-08-01), Husson, Jr. et al.
patent: 5936026 (1999-08-01), Huybrechts et al.
patent: 5973166 (1999-10-01), Mizori et al.
patent: 6034194 (2000-03-01), Dershem et al.
patent: 6034195 (2000-03-01), Dershem et al.
patent: 6187886 (2001-02-01), Husson, Jr. et al.
patent: 6265530 (2001-07-01), Herr et al.
patent: 6465893 (2002-10-01), Khandros et al.
patent: 6620905 (2003-09-01), Musa
patent: 2002/0043986 (2002-04-01), Tay et al.
patent: 2003/0087479 (2003-05-01), He et al.
patent: 03095225 (1991-04-01), None
patent: PCT/US00/07494 (2000-09-01), None
PCT/US00/07494, Sep. 2000, Newberth, III et al.
W. Oppolzer and V. Snieckus, “Intramolecular Ene Reactions in Organic Synthesis,”Angew. Chem. For Ed. Engl., 17, 476-86 (1978).
delos Santos Benedicto
Huneke James T.
Ji Qing
Liu Puwei
Yang Kang
Bauman Steven C.
Henkel Corporation
Lam Cathy F.
LandOfFree
Interlayer dielectric and pre-applied die attach adhesive... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Interlayer dielectric and pre-applied die attach adhesive..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interlayer dielectric and pre-applied die attach adhesive... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3839266