4. Coating processes
  5. Electrical product produced
  6. Integrated circuit, printed circuit, or circuit board

James T. Huneke

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Additive processing electroless metal plating using aqueous phot

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Interlayer dielectric and pre-applied die attach adhesive...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Interlayer dielectric and pre-applied die attach adhesive...

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating
Reexamination Certificate

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Selective metal etch technique

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent

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Profile ID: LFUS-PAI-P-1424725

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