Interface improvement by stress application during oxide...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S476000, C257SE27060

Reexamination Certificate

active

11083912

ABSTRACT:
The present invention provides, in one aspect, a method of fabricating a gate oxide layer on a microelectronics substrate. This embodiment comprises forming a stress inducing pattern on a backside of a microelectronics wafer and growing a gate oxide layer on a front side of the microelectronics wafer in the presence of a tensile stress caused by the stress inducing pattern.

REFERENCES:
patent: 6531364 (2003-03-01), Gardner et al.

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