Ronald J. Molnar

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Ball grid array integrated circuit package with thermal conducto

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
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Interdigitated wirebond programmable fixed voltage planes

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
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Lead and socket structures with reduced self-inductance

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Profile ID: LFUS-PAI-P-566862

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