Interconnection architecture for semiconductor device

Details Interconnection architecture for semiconductor device Interconnection architecture for semiconductor device

2007-06-18

2011-11-15

Nguyen, Thinh (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S763000, C438S942000, C257S786000, C257SE21476

Reexamination Certificate

active

08058169

ABSTRACT:
An interconnection architecture, for a semiconductor device (having regions arranged to include at least an inner region, an intermediate region located at least aside the inner region, and an outer region located at least on a side of the intermediate region opposite to the inner region, includes: one or more pairs of first and second signal lines, each pair extending from the inner region into the intermediate region; first portions and second portions of the first and second signal lines being parallel, respectively, the first portions being located in the inner region; the first and second portion of at least the first signal line not being collinear; and an intra-pair line-spacing, d(i), for each pair including the following magnitudes, d2 in the inner region, and d2′ in the intermediate region, where d2<d2′.

REFERENCES:
patent: 6638441 (2003-10-01), Chang et al.
patent: 7151040 (2006-12-01), Tran et al.
patent: 7413981 (2008-08-01), Tang et al.
patent: 7611944 (2009-11-01), Tran et al.
patent: 7666578 (2010-02-01), Fischer et al.
patent: 2002/0081502 (2002-06-01), Hayano et al.
patent: 2006/0046484 (2006-03-01), Abatchev et al.
patent: 2006/0211260 (2006-09-01), Tran et al.
patent: 2006/0216922 (2006-09-01), Tran et al.
patent: 2006/0216923 (2006-09-01), Tran et al.

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