Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate
2008-06-17
2009-10-06
Tran, Long K (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
C257S758000, C257SE29010, C257SE23145, C257SE23142, C438S637000, C438S638000, C438S639000, C438S640000
Reexamination Certificate
active
07598616
ABSTRACT:
A structure. The structure includes: a core electrical conductor having a top surface, an opposite bottom surface and sides between the top and bottom surfaces; an electrically conductive liner in direct physical contact with and covering the bottom surface and the sides of the core electrical conductor, embedded portions of the electrically conductive liner in direct physical contact with and extending over the core electrical conductor in regions of the core electrical conductor adjacent to both the top surface and the sides of the core electrical conductor; and an electrically conductive cap in direct physical contact with the top surface of the core electrical conductor that is exposed between the embedded portions of the electrically conductive liner.
REFERENCES:
patent: 5585673 (1996-12-01), Joshi et al.
patent: 5695810 (1997-12-01), Dubin et al.
patent: 6211084 (2001-04-01), Ngo et al.
patent: 6229211 (2001-05-01), Kawanoue et al.
patent: 6323554 (2001-11-01), Joshi et al.
patent: 6342733 (2002-01-01), Hu et al.
patent: 6706625 (2004-03-01), Sudijono et al.
patent: 6784105 (2004-08-01), Yang et al.
patent: 6975033 (2005-12-01), Ito et al.
patent: 2002/0155695 (2002-10-01), Lee et al.
patent: 2003/0143856 (2003-07-01), Givens et al.
patent: 2004/0113279 (2004-06-01), Chen et al.
Clevenger Lawrence A.
Cowley Andrew P.
Dalton Timothy J.
Yang Chih-Chao
Yoon Meeyoung H.
International Business Machines - Corporation
Schmeiser Olsen & Watts
Tran Long K
Trepp Robert M.
LandOfFree
Interconnect structure does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Interconnect structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interconnect structure will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4075581