Interconnect structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Reexamination Certificate

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Details

C257S758000, C257SE29010, C257SE23145, C257SE23142, C438S637000, C438S638000, C438S639000, C438S640000

Reexamination Certificate

active

07598616

ABSTRACT:
A structure. The structure includes: a core electrical conductor having a top surface, an opposite bottom surface and sides between the top and bottom surfaces; an electrically conductive liner in direct physical contact with and covering the bottom surface and the sides of the core electrical conductor, embedded portions of the electrically conductive liner in direct physical contact with and extending over the core electrical conductor in regions of the core electrical conductor adjacent to both the top surface and the sides of the core electrical conductor; and an electrically conductive cap in direct physical contact with the top surface of the core electrical conductor that is exposed between the embedded portions of the electrically conductive liner.

REFERENCES:
patent: 5585673 (1996-12-01), Joshi et al.
patent: 5695810 (1997-12-01), Dubin et al.
patent: 6211084 (2001-04-01), Ngo et al.
patent: 6229211 (2001-05-01), Kawanoue et al.
patent: 6323554 (2001-11-01), Joshi et al.
patent: 6342733 (2002-01-01), Hu et al.
patent: 6706625 (2004-03-01), Sudijono et al.
patent: 6784105 (2004-08-01), Yang et al.
patent: 6975033 (2005-12-01), Ito et al.
patent: 2002/0155695 (2002-10-01), Lee et al.
patent: 2003/0143856 (2003-07-01), Givens et al.
patent: 2004/0113279 (2004-06-01), Chen et al.

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