Integration scheme for constrained SEG growth on poly during...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257SE21619

Reexamination Certificate

active

07553732

ABSTRACT:
A method for constraining lateral growth of gate caps formed during an epitaxial silicon growth process to achieve raised source/drain regions on poly silicon is presented. The method is appropriate for integration into a manufacturing process for integrated circuit semiconductor devices. The method utilizes selective etch processes, dependant upon the material comprising the protective layer (hard mask) over the gate and the material of the spacers, e.g., oxide mask
itride spacers, or nitride mask/oxide spacers.

REFERENCES:
patent: 4606866 (1986-08-01), McGlothlin et al.
patent: 4868617 (1989-09-01), Chiao et al.
patent: 4877757 (1989-10-01), York et al.
patent: 4933295 (1990-06-01), Feist
patent: 5091763 (1992-02-01), Sanchez
patent: 5180464 (1993-01-01), Tatsumi et al.
patent: 5183770 (1993-02-01), Ayukawa et al.
patent: 5298454 (1994-03-01), D'Asaro et al.
patent: 5319232 (1994-06-01), Pfiester
patent: 5387309 (1995-02-01), Bobel et al.
patent: 5556462 (1996-09-01), Celii et al.
patent: 5646073 (1997-07-01), Grider et al.
patent: 5670018 (1997-09-01), Eckstein et al.
patent: 5677214 (1997-10-01), Hsu
patent: 5696012 (1997-12-01), Son
patent: 5710450 (1998-01-01), Chau et al.
patent: 5773328 (1998-06-01), Blanchard
patent: 5854136 (1998-12-01), Huang et al.
patent: 5902125 (1999-05-01), Wu
patent: 5926701 (1999-07-01), Li
patent: 5949126 (1999-09-01), Dawson et al.
patent: 5953609 (1999-09-01), Koyama et al.
patent: 5956590 (1999-09-01), Hsieh et al.
patent: 6017779 (2000-01-01), Miyasaka
patent: 6024794 (2000-02-01), Tamamura et al.
patent: 6074939 (2000-06-01), Watanabe
patent: 6077076 (2000-06-01), Comfort
patent: 6124610 (2000-09-01), Cheek et al.
patent: 6133093 (2000-10-01), Prinz et al.
patent: 6143036 (2000-11-01), Comfort
patent: 6159422 (2000-12-01), Graves et al.
patent: 6165826 (2000-12-01), Chau et al.
patent: 6165857 (2000-12-01), Yeh et al.
patent: 6165906 (2000-12-01), Bandyopadhyay et al.
patent: 6187645 (2001-02-01), Lin et al.
patent: 6190981 (2001-02-01), Lin et al.
patent: 6214049 (2001-04-01), Gayer et al.
patent: 6228730 (2001-05-01), Chen et al.
patent: 6228746 (2001-05-01), Ibok
patent: 6235568 (2001-05-01), Murthy et al.
patent: 6245684 (2001-06-01), Zhao et al.
patent: 6251764 (2001-06-01), Pradeep et al.
patent: 6255152 (2001-07-01), Chen
patent: 6271572 (2001-08-01), Fujita
patent: 6277700 (2001-08-01), Yu et al.
patent: 6277736 (2001-08-01), Chen et al.
patent: 6284662 (2001-09-01), Mikagi
patent: 6294432 (2001-09-01), Lin et al.
patent: 6303447 (2001-10-01), Chhagan et al.
patent: 6313017 (2001-11-01), Varhue
patent: 6316302 (2001-11-01), Cheek et al.
patent: 6335251 (2002-01-01), Miyano et al.
patent: 6346447 (2002-02-01), Rodder
patent: 6346468 (2002-02-01), Pradeep et al.
patent: 6346505 (2002-02-01), Morita et al.
patent: 6348387 (2002-02-01), Yu
patent: 6380043 (2002-04-01), Yu
patent: 6383877 (2002-05-01), Ahn et al.
patent: 6387765 (2002-05-01), Chhagan et al.
patent: 6403434 (2002-06-01), Yu
patent: 6436841 (2002-08-01), Tsai et al.
patent: 6440851 (2002-08-01), Agnello et al.
patent: 6444578 (2002-09-01), Cabral et al.
patent: 6451693 (2002-09-01), Woo et al.
patent: 6461385 (2002-10-01), Gayer et al.
patent: 6472283 (2002-10-01), Ishida et al.
patent: 6479358 (2002-11-01), Yu
patent: 6596138 (2003-07-01), Shibasaki
patent: 6600212 (2003-07-01), Takayanagi et al.
patent: 6649489 (2003-11-01), Chang et al.
patent: 6673637 (2004-01-01), Wack et al.
patent: 6677233 (2004-01-01), Dubin
patent: 6679946 (2004-01-01), Jackson et al.
patent: 6713350 (2004-03-01), Rudeck
patent: 6726767 (2004-04-01), Marrs et al.
patent: 6727553 (2004-04-01), Kotani
patent: 6777759 (2004-08-01), Chau et al.
patent: 6800213 (2004-10-01), Ding et al.
patent: 6812045 (2004-11-01), Nikoonahad et al.
patent: 6890391 (2005-05-01), Aoki et al.
patent: 6908822 (2005-06-01), Rendon et al.
patent: 6924518 (2005-08-01), Iinuma et al.
patent: 6946371 (2005-09-01), Langdo et al.
patent: 6979622 (2005-12-01), Thean et al.
patent: 7008835 (2006-03-01), Jin et al.
patent: 7014788 (2006-03-01), Fujimura et al.
patent: 7018891 (2006-03-01), Doris et al.
patent: 7037793 (2006-05-01), Chien et al.
patent: 7176522 (2007-02-01), Cheng et al.
patent: 7183662 (2007-02-01), Kim et al.
patent: 7190036 (2007-03-01), Ko et al.
patent: 7220650 (2007-05-01), Kao et al.
patent: 7226832 (2007-06-01), Yeo et al.
patent: 7235848 (2007-06-01), Jeng
patent: 7241700 (2007-07-01), En et al.
patent: 7314804 (2008-01-01), Lindert et al.
patent: 7355262 (2008-04-01), Ko et al.
patent: 7358551 (2008-04-01), Chidambarrao et al.
patent: 7358574 (2008-04-01), Choi
patent: 2001/0012693 (2001-08-01), Talwar et al.
patent: 2002/0048890 (2002-04-01), Wieczorek et al.
patent: 2002/0063084 (2002-05-01), Lin et al.
patent: 2002/0104846 (2002-08-01), Rosenfeld
patent: 2002/0135017 (2002-09-01), Vogt et al.
patent: 2002/0137297 (2002-09-01), Kunikiyo
patent: 2002/0142616 (2002-10-01), Giewont et al.
patent: 2002/0171107 (2002-11-01), Cheng et al.
patent: 2003/0038323 (2003-02-01), Kotani
patent: 2003/0042515 (2003-03-01), Xiang et al.
patent: 2003/0045131 (2003-03-01), Verbeke et al.
patent: 2003/0098479 (2003-05-01), Murthy et al.
patent: 2003/0124840 (2003-07-01), Dubin
patent: 2004/0041216 (2004-03-01), Mori
patent: 2004/0053481 (2004-03-01), Chakravarthi et al.
patent: 2004/0118812 (2004-06-01), Watkins et al.
patent: 2004/0119102 (2004-06-01), Chan et al.
patent: 2004/0132291 (2004-07-01), Lee et al.
patent: 2005/0090066 (2005-04-01), Zhu et al.
patent: 2005/0112817 (2005-05-01), Cheng et al.
patent: 2005/0118769 (2005-06-01), Kammler et al.
patent: 2005/0121719 (2005-06-01), Mori
patent: 2005/0124126 (2005-06-01), Wu
patent: 2005/0130434 (2005-06-01), Chien et al.
patent: 2005/0153566 (2005-07-01), Han et al.
patent: 2005/0176205 (2005-08-01), Chien et al.
patent: 2005/0212015 (2005-09-01), Huang et al.
patent: 2005/0252443 (2005-11-01), Tsai et al.
patent: 2006/0014366 (2006-01-01), Currie
patent: 2006/0094215 (2006-05-01), Frohberg et al.
patent: 2006/0099766 (2006-05-01), Jin et al.
patent: 2006/0121688 (2006-06-01), Ko et al.
patent: 2006/0131648 (2006-06-01), Ahn et al.
patent: 2006/0145270 (2006-07-01), Choi
patent: 2006/0151776 (2006-07-01), Hatada et al.
patent: 2006/0151840 (2006-07-01), Maekawa
patent: 2006/0154410 (2006-07-01), Choi et al.
patent: 2006/0175686 (2006-08-01), Murata et al.
patent: 2006/0202237 (2006-09-01), Huang et al.
patent: 2006/0220148 (2006-10-01), Furukawa et al.
patent: 2006/0252191 (2006-11-01), Kammler et al.
patent: 2006/0281271 (2006-12-01), Brown et al.
patent: 2007/0018205 (2007-01-01), Chidambarrao et al.
patent: 2007/0042602 (2007-02-01), Watkins et al.
patent: 2007/0057324 (2007-03-01), Tews et al.
patent: 2007/0132013 (2007-06-01), Banerjee et al.
patent: 2007/0132035 (2007-06-01), Ko et al.
patent: 2007/0166937 (2007-07-01), Adetutu et al.
patent: 06326049 (1994-11-01), None
Van Meer et al., “70 nm Fully-Depleted SOI CMOS Using A New Fabrication Scheme: The Spacer/Replacer Scheme,” IMEC, Leuven, Belgium.
Wolf et al., “Silicon Processing for the VLSI Era vol. 1: Process Technology”, ISBN 0-91672-3-7, University of California, Sunset Beach, California, pp. 521-542.
Chau et al., “A 50nm Depleted-Substrate CMOS Transistor (DST),” 2001 IEEE, Intel Corporation, Hillsboro, Oregon.
Cohen et al., “A Self-Aligned Silicide Process Utilizing ION Implants for Reduced Silicon Consumption And Control of the Silicide Formation Temperature,” vol. 716, 2002 Materials Research Society, pp. B.1.7.1-B1.7.6, Yorktown Heights, New York.
Ghani et al., “A 90nm High Volume Manufacturing Logic Technology Featuring Novel 45nm Gate Length Strained Silicon CMOS Transistors,” 2003 IEEE, 3 pages.
Actions on the Merits by U.S.P.T.O. as of Feb. 18, 2008, 8 pages.
U.S.P.T.O. Actions on the Merits as of Oct. 17, 2007, 6 pages.
Nojiri et al., “Bias-Dependent Etching of Silicon In Aqueous Ammonia,” Central Engineering Lab. Nissan Motor Co., 1991 IEEE, pp. 136-139, Yokosuka, Japan.
Branebjerg et al., “Dopant

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Integration scheme for constrained SEG growth on poly during... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integration scheme for constrained SEG growth on poly during..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integration scheme for constrained SEG growth on poly during... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4121230

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.