Integrated treatment method for obtaining robust low...

Details Integrated treatment method for obtaining robust low... Integrated treatment method for obtaining robust low...

2006-07-04

2006-07-04

Dang, Phuc T. (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S654000

Reexamination Certificate

active

07071093

ABSTRACT:
An integrated method comprises providing a low dielectric material, applying a first treatment altering a first property of the low dielectric material, and applying a second treatment altering a second property of the treated low dielectric material and producing a lower dielectric material with better mechanical stability.

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“IITC 2003: Searching for Better Low-K Solutions”, Jun. 16, 2003, 2 pages, V10n24, JSR Micro Materials Innovation.

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