Integrated micro-channels for 3D through silicon architectures

Details Integrated micro-channels for 3D through silicon architectures Integrated micro-channels for 3D through silicon architectures

2005-10-13

2008-10-07

Andujar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S721000, C257SE23098

Reexamination Certificate

active

07432592

ABSTRACT:
Some embodiments of the present invention include apparatuses and methods relating to integrated micro-channels for removing heat from 3D through silicon architectures.

REFERENCES:
patent: 5199165 (1993-04-01), Crawford et al.
patent: 6678168 (2004-01-01), Kenny et al.
patent: 6717251 (2004-04-01), Matsuo et al.
patent: 2004/0196634 (2004-10-01), Mallik et al.
patent: 2005/0139992 (2005-06-01), Holalkere et al.
patent: 2005/0211418 (2005-09-01), Kenny et al.

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