Integrated manufacturing packaging process

Details Integrated manufacturing packaging process Integrated manufacturing packaging process

1998-01-08

2000-10-17

Martin-Wallace, Valencia

Metal working

Method of mechanical manufacture

Electrical device making

29846, 29847, H01K 310

Patent

active

061312797

ABSTRACT:
A process of fabricating a circuitized substrate is provided which comprising the steps of: providing an organic substrate having circuitry thereon; applying a dielectric film on the organic substrate; forming microvias in said dielectric film; sputtering a metal seed layer on the dielectric film and in said microvias; plating a metallic layer on the metal seed layer; and forming a circuit pattern thereon.

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