Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
Inventor
active
Apparatus and process for improved die adhesion to organic chip
Electronic device packages having glass free non conductive laye
Integrated manufacturing packaging process
Method for reducing coefficient of thermal expansion in chip att
Method for reducing coefficient of thermal expansion in chip...
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Profile ID: LFUS-PAI-P-182292