Integrated lid formed on MEMS device

Details Integrated lid formed on MEMS device Integrated lid formed on MEMS device

2006-08-29

2006-08-29

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C073S514310, C257S415000

Reexamination Certificate

active

07098065

ABSTRACT:
An integrated lid for microelectromechanical system (MEMS) devices is formed from a nitride layer deposited over a cavity containing movable parts for the device. Pillars are formed through openings within large area movable parts to support the lid over those parts. Slides are formed and moved under large etchant openings through the lid to allow the openings to be sealed by sputtering.

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