Integrated high voltage capacitor having a top-level...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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Details

C438S240000, C438S257000, C438S258000, C438S261000, C438S275000, C257SE21008

Reexamination Certificate

active

07413947

ABSTRACT:
The present invention provides an integrated high voltage capacitor, a method of manufacture therefore, and an integrated circuit chip including the same. The integrated high voltage capacitor, among other features, includes a first capacitor plate (120) located over or in a substrate (105), and an insulator (130) located over the first capacitor plate (120), at least a portion of the insulator (130) comprising an interlevel dielectric layer (135, 138, 143,or148). The integrated high voltage capacitor further includes a second capacitor plate (160) located over the insulator (130) and a top-level dielectric layer (199) located at least partially along a sidewall of the second capacitor plate (160).

REFERENCES:
patent: 4805071 (1989-02-01), Hutter et al.
patent: 5187637 (1993-02-01), Embree
patent: 5702988 (1997-12-01), Liang
patent: 5751067 (1998-05-01), Mikagi
U.S. Appl. No. 11/249,535, filed Oct. 13, 2005; entitled “Integrated High Voltage Capacitor and a Method of Manufacture Therefor”; to David Larkin, et al.
U.S. Appl. No. 11/250,047, filed Oct. 13, 2005; entitled “Integrated High Voltage Capacitor Having Capacitance Uniformity Structures and A Method of Manufacture Therefor” to David Larkin, et al.

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