Integrated heat spreader package for heat transfer and for...

Details Integrated heat spreader package for heat transfer and for... Integrated heat spreader package for heat transfer and for...

2005-03-15

2005-03-15

Vortman, Anatoly (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S714000, C361S704000, C257S713000

Reexamination Certificate

active

06867978

ABSTRACT:
A system includes a thermal interface material (TIM) to transfer heat from a die to a heat spreader. The system includes a heat transfer subsystem disposed on the backside surface of the die. In one embodiment, the heat transfer subsystem comprises a first heat transfer material and a second heat transfer material discretely disposed within the first heat transfer material. A method of bonding a die to a heat spreader uses a die-referenced process as opposed to a substrate-referenced process.

REFERENCES:
patent: 4811166 (1989-03-01), Alvarez et al.
patent: 5050040 (1991-09-01), Gondusky et al.
patent: 5901446 (1999-05-01), Szymansky
patent: 6114005 (2000-09-01), Nagai et al.
patent: 20020000239 (2002-01-01), Sachdev et al.
patent: 20030117775 (2003-06-01), Vrtis et al.

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