Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2002-10-02
2010-12-07
Landau, Matthew C (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C257S707000, C257S708000
Reexamination Certificate
active
07846778
ABSTRACT:
An integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and a method of making an electronic assembly.
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Dani Ashay
Houle Sabina J.
Jayaraman Saikumar
Koning Paul A.
Rumer Christopher L.
Greaves John N.
Intel Corporation
Landau Matthew C
Mitchell James M
LandOfFree
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