Integrated heat spreader, heat sink or heat pipe with...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support

Reexamination Certificate

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C257S707000, C257S708000

Reexamination Certificate

active

07846778

ABSTRACT:
An integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and a method of making an electronic assembly.

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