Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1992-11-09
1994-03-08
James, Andrew J.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
361689, 361699, 257712, 257717, H01L 2302, H01L 2504, H02B 100, H02K 500
Patent
active
052930700
ABSTRACT:
An integrated heat sink module includes a sinuously channeled base and a bonded top surface electrode that is dielectrically isolated from the base. The top surface electrode acts as a common modular electrode capable of conducting heat to an ultimate cooling medium with no intervening thermal barrier. Constrained copper technology (CCT) is employed to ensure that the relatively low effective temperature coefficient of expansion of the channel base is acquired by the channel cover, which is the dielectrically (but not thermally) insulated top surface, and that the common electrode is integrated with, by forming a part of, the fluid channel in the base. The heat sink weight is reduced significantly by the channeling, while use of the CCT technology ensures high reliability and integrity of the module.
REFERENCES:
patent: 3744120 (1973-07-01), Burgess et al.
patent: 3911553 (1975-10-01), Burgess et al.
patent: 4409278 (1983-10-01), Jochym
patent: 4551787 (1985-11-01), Mittal et al.
patent: 4563383 (1986-01-01), Kuneman et al.
patent: 4672422 (1987-06-01), Schierz
patent: 4884168 (1989-11-01), August et al.
Burgess James F.
DeDoncker Wivina A. A. Rik
Jones Donald W.
Neugebauer Constantine A.
General Electric Company
James Andrew J.
Jr. Carl Whitehead
Snyder Marvin
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