Integrated endpoint detection system with optical and eddy...

Details Integrated endpoint detection system with optical and eddy... Integrated endpoint detection system with optical and eddy...

2007-03-27

2007-03-27

Wilson, Lee D. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S041000, C451S288000, C073S865900, C073S599000

Reexamination Certificate

active

11217598

ABSTRACT:
A chemical mechanical polishing apparatus and method can use an eddy current monitoring system and an optical monitoring system. Signals from the monitoring systems can be combined on an output line and extracted by a computer. A thickness of a polishing pad can be calculated. The eddy current monitoring system and optical monitoring system can measure substantially the same location on the substrate.

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