Abrading – Precision device or process - or with condition responsive... – Computer controlled
Reexamination Certificate
2005-11-22
2005-11-22
Hail, III, Joseph J. (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
Computer controlled
C451S006000, C451S007000, C451S008000, C451S041000, C451S207000, C451S288000, C324S230000, C324S232000, C324S237000
Reexamination Certificate
active
06966816
ABSTRACT:
A chemical mechanical polishing apparatus and method can use an eddy current monitoring system and an optical monitoring system. Signals from the monitoring systems can be combined on an output line and extracted by a computer. A thickness of a polishing pad can be calculated. The eddy current monitoring system and optical monitoring system can measure substantially the same location on the substrate.
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Birang Manoocher
Johansson Nils
Swedek Boguslaw A
Applied Materials Inc.
Fish & Richardson
Hail III Joseph J.
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