Integrated device with improved connections between the pins and

Details Integrated device with improved connections between the pins and Integrated device with improved connections between the pins and

1990-09-17

1992-05-12

James, Andrew J.

357 65, 357 67, H01L 2348, H01L 2940, H01L 2944, H01L 2946

Patent

active

051132397

ABSTRACT:
An integrated device with improved connections between the pins and the semiconductor material chip which integrates electronic components. In order to allow the integration of signal components and power components in a same device with a reduced use of area for the soldering pads and with high reliability of the connections, the connecting wires are made of different materials. Advantageously, the wires for the power connections are based on aluminum and have large diameters, and the wires for the signal connections are gold-based and have a small diameter. In order to ensure good soldering, the ends of the pins on which the connecting wires are to be soldered are gold-plated.

REFERENCES:
patent: 4458297 (1984-07-01), Stopper et al.
patent: 4818895 (1989-04-01), Kaufman
patent: 4942455 (1990-07-01), Shinohara

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