4. Metal fusion bonding
  5. Process
  6. Plural diverse bonding

Angelo Massironi

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Integrated device with improved connections between the pins and

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Metal heat sink baseplate for a semiconductor device

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
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Package for integrated devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
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Press striking of die stamped metal frames for single-in-line pa

Metal working – Plural diverse manufacturing apparatus including means for... – Binding or covering and cutting
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Process for manufacturing integrated device with improved connec

Metal fusion bonding – Process – Plural diverse bonding
Patent

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Profile ID: LFUS-PAI-P-1098801

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