Integrated circuitry, methods of reducing alpha particle inflict

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438152, 438153, 438241, 257903, 257904, 257953, H01L 218234

Patent

active

06146936&

ABSTRACT:
The present invention pertains to methods of forming integrated circuitry, methods of forming SRAM cells, and methods of reducing alpha particle inflicted damage to SRAM cells. Additionally, the present invention pertains to integrated circuitry. In one aspect, the invention includes a method comprising: a) forming at least one second conductivity type diffusion region beneath at least one of an SRAM cell pull-down device drain of a first conductivity type and an SRAM cell access device source of the first conductivity type; and b) not forming a second conductivity type diffusion region beneath at least one of a source of the SRAM cell pull-down device and a drain of the SRAM cell access device. In another aspect, the invention includes a method comprising: a) providing a semiconductor substrate; b) defining an SRAM cell pull-down device region of the semiconductor substrate, the pull-down device region comprising a pull-down device source region and a pull-down device drain region; c) defining an SRAM access device source region and an access device drain region; d) defining a field oxide isolation region of the semiconductor substrate; and e) in a common implant, implanting a conductivity-enhancing dopant of a first conductivity type beneath the field oxide region, beneath the access device source region, and beneath the pull-down device drain region; the common implant not implanting the conductivity-enhancing dopant of the first conductivity type beneath at least one of the access device drain region and the pull-down device source region.

REFERENCES:
patent: 4110776 (1978-08-01), Rao et al.
patent: 4442591 (1984-04-01), Haken
patent: 4546535 (1985-10-01), Shepard
patent: 4613885 (1986-09-01), Haken
patent: 4635085 (1987-01-01), Taguchi
patent: 4702494 (1987-10-01), Shimano et al.
patent: 4702796 (1987-10-01), Nakajima et al.
patent: 4728619 (1988-03-01), Pflester et al.
patent: 4735915 (1988-04-01), Kita et al.
patent: 4864382 (1989-09-01), Aoki et al.
patent: 5057893 (1991-10-01), Sheng et al.
patent: 5102811 (1992-04-01), Scott
patent: 5108945 (1992-04-01), Mathews
patent: 5109258 (1992-04-01), Redwine
patent: 5122846 (1992-06-01), Haken
patent: 5168335 (1992-12-01), D'Arrigo et al.
patent: 5173438 (1992-12-01), Sandhu
patent: 5240874 (1993-08-01), Roberts
patent: 5349225 (1994-09-01), Redwine et al.
patent: 5384476 (1995-01-01), Nishizawa et al.
patent: 5405788 (1995-04-01), Manning et al.
patent: 5453640 (1995-09-01), Kinshita
patent: 5489546 (1996-02-01), Ahmad et al.
patent: 5501993 (1996-03-01), Borland
patent: 5552623 (1996-09-01), Nishizawa et al.
patent: 5592011 (1997-01-01), Yang
patent: 5620922 (1997-04-01), Yoshida et al.
patent: 5631187 (1997-05-01), Phipps et al.
patent: 5693975 (1997-12-01), Lien
patent: 5705437 (1998-01-01), Wu et al.
patent: 5770497 (1998-06-01), Wu et al.
patent: 5798551 (1998-08-01), Kikushima et al.
Stanley Wolf, Ph.D., Silicon Processing for the VLSI Era, vol. 2: Process Integration, pp. 23-25, 333, 428-431, 691-693.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Integrated circuitry, methods of reducing alpha particle inflict does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuitry, methods of reducing alpha particle inflict, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuitry, methods of reducing alpha particle inflict will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2064258

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.